Module Handbook

  • Dynamischer Default-Fachbereich geändert auf MV

Notes on the module handbook of the department Mechanical and Process Engineering

Die hier dargestellten veröffentlichten Studiengang-, Modul- und Kursdaten des Fachbereichs Maschinenbau und Verfahrenstechnik ersetzen die Modulbeschreibungen im KIS und wuden mit Ausnahme folgender Studiengänge am 28.10.2020 verabschiedet.

Ausnahmen:

Course MV-AWOK-86188-K-4

Adhesive Bonding Technologies (2V, 3.0 LP)

Course Type

SWS Type Course Form CP (Effort) Presence-Time / Self-Study
2 V Lecture 3.0 CP 28 h 62 h
(2V) 3.0 CP 28 h 62 h

Basedata

SWS 2V
CP, Effort 3.0 CP = 90 h
Position of the semester 1 Sem. in SuSe
Level [4] Bachelor (Specialization)
Language [DE] German
Lecturers
Area of study [MV-AWOK] Materials and Surface Technologies
Additional informations
Livecycle-State [NORM] Active

Contents

  • Adhesive bonding as a joining technology
  • Basics of adhesion
  • Surface pretreatments to enhance adhesion
  • Structure and properties of adhesives and adhesion promoters
  • Structural design of bonded joints
  • Destructive and non-destructive testing methods for adhesively bonded joints
  • Mechanical properties, damage analysis
  • Quality assurance in adhesive manufacturing and adhesive bonding

Competencies / intended learning achievements

Students will be able to
  • apply adhesive bonding technology to join metals, polymers, glass and other mineral materials
  • name bonding applications and bonding processes in vehicle construction and other industries
  • explain the fundamentals of adhesion
  • name surface pretreatment prior to adhesive bonding
  • explain the structure and properties of adhesives and adhesion promoters
  • apply destructive and non-destructive testing methods for bonded joints
  • design and calculate the mechanical strength of adhesively bonded joints
  • name quality assurance methods in industrial adhesive bonding

Literature

  • W. Brockmann, P. L. Geiß, J. Klingen, B. Schröder: „Klebtechnik – Klebstoffe, Anwendungen und Verfahren“, Wiley-VCH, Weinheim, 2005
  • G. Habenicht: „Kleben, Grundlagen, Technologie, Anwendungen“, Springer Verlag 1997

Materials

PowerPoint presentation, blackboard, flipchart. For further information and course materials please consider the corresponding OLAT-course.

Requirements for attendance (informal)

None

Requirements for attendance (formal)

None

References to Course [MV-AWOK-86188-K-4]

Module Name Context
[MV-AWOK-223-M-4] Adhesive Bonding Technologies P: Obligatory 2V, 3.0 LP